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Features of photolitography in a deep uv

Authors: Baklykov D.A., Gromov M.I., Tashev R.A.
Published in issue: #10(39)/2019
DOI: 10.18698/2541-8009-2019-10-535


Category: Mechanical Engineering and Machine Science | Chapter: Technology and Equipment of Mechanical and Physical Processing

Keywords: deep ultraviolet photolithography, numerical aperture, Rayleigh criterion, drop plasma source, high-temperature plasma, multilayer optical system, photomask, photoresist
Published: 08.10.2019

Now one of the most promising is the method of photolithography in deep ultraviolet. The main advantages and disadvantages of this method, the characteristic materials of photoresists and the optical system are shown. The system for transmitting an image onto a substrate is described in detail with the highlighting of the function of each coating used in it. The design of the unit for reproducing the photolithography method in deep ultraviolet is given, and individual components of the system are examined in detail with highlighting the requirements for each of them. The modern areas of application of the method and its production limitations are shown.


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